As we all know, PCB processing is completed, with a certain shelf life, if more than the shelf life, the PCB must be baked, otherwise the PCB is easy to break in the SMT production line production. So what are the things to pay attention to when baking PCB? FWT recommends that you do the following.

1. When baking PCB, FWT recommends using a temperature of 105 ± 5 degrees Celsius. The boiling point of water is 100 degrees Celsius, so when it exceeds the boiling point, the water becomes steam. There are not too many water molecules on the PCB, so it does not need too high a temperature to speed up the evaporation rate.

If the temperature is too high or the vaporization rate is too fast, the water vapor will expand rapidly, which is not good for the quality. Especially for multilayers and PCBs with buried holes. 105 degrees is the boiling point of water and not too high a temperature to reduce the risk of dehumidification and oxidation. In addition, the temperature control ability of Forward Oven does a very good job.

2. When baking PCBs, it is recommended to use “vertical” and gap baking. This is because it allows you to maximize the effect of hot air convection and makes it easier for moisture to bake on the PCB. However, for large PCBs, you may need to consider whether the vertical shape will cause the board to warp and distort. 3.

3. After baking the PCB, it is recommended to place it in a dry place and allow it to cool down quickly. It is a good idea to press the “anti-bend fixture” on the top of the board, as common objects are easy. It is designed to absorb water vapor from the high temperature conditions into the cooling process, but rapid cooling may cause the board to warp, which needs to be balanced. 4.

4. The need to bake the PCB depends on observing whether the package is damp, i.e. whether there is moisture on the HIC (Humidity Indicator Card) in the vacuum package. If the package is intact, the HIC will not show moisture. FORWARD recommends that you can do this yourself without baking the wires.