This depends on what we are baking the PCB for? Different needs to have a different way to bake out the effect is not the same. Not the same PCB board size will be placed in different ways. We all know that the oven is not closed inside, left and right into the air, with the top to absorb humidity and exhaust. That is to say that the baking board to follow the direction of air flow is good.

Then PCB baking can be placed in such a way to consider:

1, large-size PCB baking, using flat stacked placement, it is recommended that a stack of up to the number of recommendations may not exceed 30 pieces, baking is completed within 10 bells need to open the oven to remove the PCB and lay it down so that it cools down, after baking the need to press the anti-board bending jig. Large size PCB is not recommended upright baking, easy to bend.

2, small and medium-sized PCB baking, you can use the flat stacked placement, a stack of up to the number of recommended not more than 40 pieces, can also be taken upright, the number is not limited to the completion of the baking within 10 minutes of the need to open the oven to remove the PCB and lay it flat to cool it down after baking the need to press the anti-board bending jig.

Forward production of curing oven, with multiple electrical circuit protection, with PID function to ensure temperature stability, according to customer demand, customized oven.

Finally, Forward reminded everyone in the PCB baking need to pay attention to the following matters:

1, the oven remember to install ventilation drying equipment, otherwise baked water vapor will remain in the oven instead of increasing its relative humidity, not conducive to PCB dehumidification.

2, to the quality point of view, the use of the fresher the quality of PCB solder after the oven is better, even if the expiration date of the PCB to take to the baking before using or there will be a certain quality risk.

3, the baking temperature can not exceed the PCB Tg point, the general requirements can not exceed 125 ℃. Early some lead PCB Tg point is relatively low, now most of the lead-free PCB Tg at 150 ℃ or more.

4, after baking the PCB should be used as soon as possible, if not used should be re-vacuum packaging as soon as possible. If exposed to the workshop for too long, it must be re-baked.