We know that different PCB manufacturers of manufacturing capacity and manufacturing process is different, PCB board shelf life and baking requirements are different.

For example, the OSP process and pure immersion gold process PCB, generally in the package after the shelf life is 6 months, for the OSP process generally do not advocate baking.

On the other hand, PCB preservation and baking moment with the region has a great deal to do with.

Such as the south of China's humid climate, moisture is generally heavier, especially in the Pearl River Basin region, in March and April each year, every day rainy, at this time the moisture is very heavy. If the PCB is exposed to the air within 24 hours must be used up, or prone to oxidation. In the normal after opening, 8 hours to use up is the best. For some need to bake the PCB, baking moment should be longer.

In my northern region, the weather is generally drier, PCB preservation time will be longer, the baking moment should be shorter. Baking temperature is generally 120 ± 5 ℃ baking, baking moment according to the specific circumstances to decide.

Therefore, we are in the PCB baking and preservation, must be differentiated according to the different situations, try to reduce waste, improve PCB utilization, FWT production of static vertical oven / box can be a solution to the different requirements of the PCB baking.